Provide electronic ceramic solutions with outstanding performance for solving the “three-high” issues of chip packaging - High Heat, High Voltage and High Frequency.
ABOUT US
PGT has built a complete IDM process platform and mass production line that is completely independent and controllable from submount design, ceramic pretreatment, PVD thin film technology, precision electroplating, lithography and etching, high precision grinding and polishing, packaging and testing etc. It realized self-control in core materials and key equipment.
50000m2
Factory area 50000m2
5,000,000
Capacity up to 5 million tablets by 2024
138,600,000
Cumulative investment of 138,603,000
To provide customers around the world with electronic ceramic products with excellent performance.
PGT has built a complete IDM process platform and mass production line that is completely independent and controllable from submount design, ceramic pretreatment, PVD thin film technology, precision electroplating, lithography and etching, high precision grinding and polishing, packaging and testing etc. It realized self-control in core materials and key equipment.